Home>Phone Repair Tool>BGA Reballing Stencil>WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil

WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil Item NO.: WL-60

$ 0.58

model:
WL-60	$ 3.70	Stock(500)	- +

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Product Name	WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil
Item NO.	WL-60
Weight	0.05 kg = 0.1102 lb = 1.7637 oz
Category	Phone Repair Tool > BGA Reballing Stencil
Tag	BGA Reballing Stencil
Creation Time	2021-03-08

Product Information

Brand Name	HCQS
Model Number	WL-60

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A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

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