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Home>Phone Repair Tool>BGA Reballing Stencil>WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil
WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil

WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil Item NO.: WL-60

$ 0.54
model:
WL-60 $ 3.46 Stock(500)
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Product Name WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO BT IF IC Chip BGA Reballing Stencil
Item NO. WL-60
Weight 0.05 kg = 0.1102 lb = 1.7637 oz
Category Phone Repair Tool > BGA Reballing Stencil
Tag BGA Reballing Stencil
Creation Time 2021-03-08

Product Information
 
 
 
Brand Name HCQS
Model Number WL-60
 
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We offer you

A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience 

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

 
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