Home>Phone Repair Tool>BGA Reballing Stencil>For xiaomi 10/9/8/6/5/4/CC9/MIX/Redmi K20/NOTE8/K30 PRO/NOTE/4/4A/5S IC Chip Reballing Stencil Solder BGA Heating Template

For xiaomi 10/9/8/6/5/4/CC9/MIX/Redmi K20/NOTE8/K30 PRO/NOTE/4/4A/5S IC Chip Reballing Stencil Solder BGA Heating Template Item NO.: AMAOE MI1-12

$ 0.71

model:
MI12	$ 4.57	Stock(500)	- +
MI11	$ 4.57	Stock(500)	- +
MI10	$ 4.57	Stock(500)	- +
MI9	$ 4.57	Stock(500)	- +
MI8	$ 4.57	Stock(500)	- +
MI7	$ 4.57	Stock(500)	- +
MI6	$ 4.57	Stock(500)	- +
MI5	$ 4.57	Stock(500)	- +
MI4	$ 4.57	Stock(500)	- +
MI3	$ 4.57	Stock(500)	- +

Quantity: 0 , Subtotal 0

Trade please contact our sales manager to get the best price

Product Name	For xiaomi 10/9/8/6/5/4/CC9/MIX/Redmi K20/NOTE8/K30 PRO/NOTE/4/4A/5S IC Chip Reballing Stencil Solder BGA Heating Template
Item NO.	AMAOE MI1-12
Weight	0.05 kg = 0.1102 lb = 1.7637 oz
Category	Phone Repair Tool > BGA Reballing Stencil
Tag	BGA Reballing Stencil
Creation Time	2021-03-08

Product Information

Product Type	chip bga reballing for xiaomi
Brand Name	HCQS
Model Number	AMAOE MI1-12
Function1:	SDR660 BGA STENCIL
Function2:	xiaomi BGA STENCIL
Function3:	PM7150/PM7150A BGA STENCIL
Function4:	PM8150/PM8150A BGA STENCIL
Function5:	SDR8150 BGA STENCIL
Function6:	WCD9340 BGA STENCIL
Function7:	for xiaomi bga stencil
Function8:	for redmi bga stencil
Function9:	bga reballing for xiaomi

Product Display

CompanyInfo

Company Profile

undefined

Product Process

Production Process

undefined

Certifications

undefined

Product Packaging

undefined

Shipment & Payment

Our Advantages

We offer you

A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

undefined