| model: | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| A13 11pro-MAX | $ 3.85 | ||||||||
| A12 XS-XR-XS MAX | $ 3.85 | ||||||||
| A11 8-8P-X | $ 3.85 | ||||||||
| A10 7-7P | $ 3.85 | ||||||||
| A9 6S-6SP | $ 3.85 | ||||||||
| A8 6G 6P | $ 3.85 | ||||||||
Quantity: 0 , Subtotal 0 | |||||||||
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Copy| Product Name | Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone CPU A8 A9 A10 A11 A12 A13 11 Pro Max XS XR X 8 8P 7P 6S 6 |
| Item NO. | BGA Reballing Stencil CPU A8 A9 A10 A11 A12 A13 11 Pro Max XS XR |
| Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
| Category | Phone Repair Tool > BGA Reballing Stencil |
| Tag | BGA Reballing Stencil |
| Creation Time | 2021-03-08 |
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