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Home>Phone Repair Tool>BGA Reballing Stencil>For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template
For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template

For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template Item NO.: IPAD BGA Reballing Stencil

$ 0.85
model:
IPAD PRO $ 5.44 Stock(500)
- +
IPAD MINI4 $ 5.44 Stock(500)
- +
IPAD MINI 2-3 $ 5.44 Stock(500)
- +
IPAD3-4 $ 5.44 Stock(500)
- +
IPAD2/MINI1 $ 5.44 Stock(500)
- +
Quantity: 0 , Subtotal 0

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Product Name For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template
Item NO. IPAD BGA Reballing Stencil
Weight 0.05 kg = 0.1102 lb = 1.7637 oz
Category Phone Repair Tool > BGA Reballing Stencil
Tag BGA Reballing Stencil
Creation Time 2021-03-08

Product Information
 
 
 
Brand Name HCQS
Model Number AMAOE PAD2 mini
Function1: 343S0543 BGA STENCIL
Function2: 343S0622 BGA STENCIL
Function3: FOR IPAD BGA STENCIL
Function4: U8100
 
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We offer you

A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience 

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

 
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