Home>Phone Repair Tool>BGA Reballing Stencil>For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template

For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template Item NO.: IPAD BGA Reballing Stencil

$ 0.91

model:
IPAD PRO	$ 5.81	Stock(500)	- +
IPAD MINI4	$ 5.81	Stock(500)	- +
IPAD MINI 2-3	$ 5.81	Stock(500)	- +
IPAD3-4	$ 5.81	Stock(500)	- +
IPAD2/MINI1	$ 5.81	Stock(500)	- +

Quantity: 0 , Subtotal 0

Trade please contact our sales manager to get the best price

Product Name	For ipad PRO 10.5/12.9/9.7/2/3/4/5/6 AIR 1/2mini/mini 1/2/3/4 USB IC CHIP steel mesh BGA Reballing Stencil Tin Solder Template
Item NO.	IPAD BGA Reballing Stencil
Weight	0.05 kg = 0.1102 lb = 1.7637 oz
Category	Phone Repair Tool > BGA Reballing Stencil
Tag	BGA Reballing Stencil
Creation Time	2021-03-08

Product Information

Brand Name	HCQS
Model Number	AMAOE PAD2 mini
Function1:	343S0543 BGA STENCIL
Function2:	343S0622 BGA STENCIL
Function3:	FOR IPAD BGA STENCIL
Function4:	U8100

Product Display

CompanyInfo

Company Profile

undefined

Product Process

Production Process

undefined

Certifications

undefined

Product Packaging

undefined

Shipment & Payment

Our Advantages

We offer you

A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

undefined