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Home>Phone Repair Tool>BGA Reballing Stencil>WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool
WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool

WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework toolItem NO.: 1033

$ 10.37
Color:
BASE
$ 12.59
- +
A13 whole CPU mold
$ 10.37
- +
A6-A7 whole cpu mold
$ 10.37
- +
A11 whole CPU mold
$ 10.37
- +
A12 whole CPU mold
$ 10.37
- +
A8 whole CPU mold
$ 20.74
- +
A9 whole CPU mold
$ 20.74
- +
A10 whole CPU mold
$ 20.74
- +
A8 Upper
$ 10.37
- +
A6 Upper
$ 10.37
- +
A9 Upper
$ 10.37
- +
A9 Lower
$ 10.37
- +
A8 Lower
$ 10.37
- +
A10 Upper
$ 10.37
- +
A10 Lower
$ 10.37
- +
A7 Upper
$ 10.37
- +
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WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool
color:red,size:xxl
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    • Product Name: WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool
    • Item NO.: 1033
    • Weight: 0.1 kg = 0.2205 lb = 3.5274 oz
    • Category: Phone Repair Tool > BGA Reballing Stencil
    • Creation Time: 2021-05-24

    [xlmodel]-[custom]-[8888]

    High Quality WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 CPU Upper Lower Soldering Precise positioning mold
    Product description:
    Optional 1Magnetic baseThis is a universal mold
    Optional 2A11 whole cpu mold
    Optional 3A12 whole cpu mold
    Optional 4A8 whole cpu mold
    Optional 5A 9  whole cpu mold
    Optional 6A10  whole cpu mold
    Optional 7A8 Upper
    Optional 8A8 lower
    Optional 9A9 Upper
    Optional 10A9 lower
    Optional 11A10 Upper
    Optional 12A10 lower
    A8-10 There is a separate upper positioning mold and plant tin mesh, A11 A12 is the CPU as a whole into the lower layer cpu plant tin network
    With Fixed Plate ( Black Positioning Mold ), Easy to use and more accurate CPU IC welding position.A
    [ Option Aluminum Mould Base ]: it is universal, can fit with any Black Positioning Mold,
    Option Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.



    [xlmodel]-[photo]-[0000]

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